The A1330's SoC architecture includes a CVH front end, digital signal processing, and either an analogue or digital PWM output signal. The devices are offered in both single and dual die versions for systems that require redundant sensors. They also include on-chip EEPROM technology, capable of supporting up to 100 read/write cycles, for flexible end-of-line programming of calibration parameters. Both devices are suitable for automotive applications requiring 0° to 360° angle measurements, such as motor position measurements for pumps and other actuators, that require low latency and high resolution. The stacked die nature of the dual die assembly provides better channel to channel matching than more traditional side by side assembly techniques. This is a key parameter for safety critical applications where the output of the two sensors is compared to insure that the system is operating safely. Both the single and dual die versions of the A1330 are offered in a low profile, (Pb) free, 100% matt-tin leadframe plated 8-pin TSSOP package.
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