China's Telink partners with Ixys for IoT

June 20, 2016 // By Peter Clarke
Telink Semiconductor
Fabless chip company Telink Semiconductor Co. Ltd. (Shanghai, China) has partnered with the Ixys Corp. (Milpitas, Calif.), a manufacturer of power semiconductors, to work together to address the IoT market.

Telink, which was founded in 2010 and received venture capital backing from Intel in 2015, is focused on IoT chipset solutions for smart homes,
with a product portfolio that addresses Bluetooth Smart, ZigBee, 6LoWPAN/Thread and HomeKit. The company claims it has a leading position in BLE (Bluetooth low energy) mesh based solutions, with annual sales of over 100 million yuan (over $15 million) with General Electric, Philips and Cisco as customers.

Telink and Ixys plan to make use of Ixys sales channels to address Korean, Japanese and European markets with combinations of Ixys sensor technologies and Telink's IoT wireless SoCs.

"This partnership will allow us to extend the reach of networked small devices for the home and industrial markets, as well as strengthen Ixys's product portfolio," said Wenjun Sheng, CEO of Telink, in a statement.

Related links and articles:

News articles:

Intel protege pitches wireless SoC for IoT

ZigBee 3.0 to include energy harvesting

Google, Silicon Labs mesh for ZigBee-like protocol

Thread wireless protocol available


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