Fan-out wafer-level packaging market to double in 2018

April 19, 2017 // By Peter Clarke
Apple's use of fan-out wafer-level packaging (FOWLP) marked 2016 as a turning point for the technology, according to market analysis company Yole Developpement.

Apple packaged its A10 application processor in TSMC's fan-out technology and Yole predicts the market for the total FOWLP equipment market will grow from about $200 million in 2017 to nearly $400 million in 2018. Similarly, Yole reckons the FOWLP total materials market will be about $55 million in 2017 and exceed $100 million in 2018.

Market for FOWLP manufacturing equipment from 2015 to 2021. Source: Yole Developpement.

The period 2015 to 2016 also saw FOWLP adoption spreading from mobile/wireless and automotive to MEMS, RF and medical applications, Yole asserts.

Market for materials for FOWLP from 2015 to 2021. Source: Yole Developpement.

Related links and articles:

www.yole.fr

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