The first customer products based on 7LP are expected to launch in 1H18, with volume production ramping in 2H18. Design kits for the FX-7 ASIC offering are now available to customers, with volume production expected in 2019.
The FX-7 design platform combines the manufacturing process technology with intellectual property and options for 2.5D/3D packaging and follows the same lines as FX-14, which Globalfoundries offers to support its 14nm FinFET process.
FX-7 interface IPs include: 60G, 112G SERDES, low-voltage SRAM, embedded TCAM, integrated DACs/ADCs and ARM processors. In addition, the FX-7 portfolio enables new design methodologies and complex ASIC solutions for lower power and high-performance applications targeting hyper-scale data centers, 5G networking, and machine and deep learning applications. Future extensions are planned to support solutions for automotive ADAS and imaging applications.
"With its new FX-7 ASIC offering, GF is extending its reach beyond traditional foundry customers to a new generation of systems companies who are looking to leverage bleeding-edge silicon processes for a wide range of applications, from deep learning for artificial intelligence to next-generation 5G networks," said Jim McGregor, founder and principal analyst at Tirias Research, in a statement issued by Globalfoundries.
Related links and articles: