Lattice will migrate products to FDSOI

November 29, 2017 // By Peter Clarke
Programmable logic device vendor Lattice Semiconductor Corp. (Portland, Oregon) is migrating its entire product line to fully-depleted silicon-on-insulator (FDSOI) manufacturing process technology.

Lattice will migrate to FDSOI for new products. Existing products will remain on their existing nodes and foundries, the company said.

Lattice recently escaped the attention of a China-funded venture capital when a proposed acquisition was blocked by President Donald Trump over national security concerns (see President Trump blocks Lattice deal ).

A spokesperson for the company said: "Lattice will be migrating to 28nm FDSOI, which we believe will enable us to achieve 10x lower power with the highest performance devices for edge connectivity and edge computing applications. Transitioning to FDSOI will also allow Lattice to manufacture all product lines on one manufacturing process technology this includes the original Lattice product family, the original SiliconBlue product family, as well as ASSPs [application-specific standard products] from Silicon Image and SiBeam which will result in much more effective output from our R&D operation."

At 28nm the volume foundry supplier of FDSOI is Samsung although STMicroelectronics, an original pioneer of FDSOI manufacturing process, is also able to supply some product out of its 300mm wafer fab near Grenoble, France. A 22nm variant of the FDSOI process is being developed by Globalfoundries Inc.

Lattice gave no time table for the transfer of its products to 28nm FDSOI or whether it envisioned going on to 22nm FDSOI.

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