Qualcomm, ASE to build packaging plant in Brazil

April 03, 2017 // By Peter Clarke
A consortium comprising Qualcomm, ASE Group and several Brazilian government agencies have signed a memorandum of understanding (MoU) that they will invest $200 million in a semiconductor assembly and packing plant to set up in Campinas, Sao Paulo, Brazil.

The parties signed the MoU on March 8 and the partnership has four years to invest the resources. The investment is expected to create more than 1,200 jobs.

Meanwhile Qualcomm, ASE Group and the National Bank of Brazil have signed a joint-venture deal to develop 5G and IoT products in Brazil, according to Taiwan News which cited Tejas Krishnamohan, senior director of corporate strategy at Qualcomm, as its source.

Chipsets manufactured will be used in devices such as 4G and 5G smartphones and Internet of Things (IoT) devices.

As part of the agreement Qualcomm and ASE will train Brazilian engineers abroad and bring their own professionals to Brazil to facilitate knowledge exchange.

"As the world's leading company in integrated circuit assembly and testing, we are excited about the opportunity to expand our presence in Brazil and generate value for the Brazilian high-tech industry through the development and manufacturing of our advanced SiP [System-in-Packaging] technology," said Tien Wu, director of operations at ASE, in a statement issued by the Brazilian government.

Brazil is pushing to be an early adopter of 5G and signed an agreement March 2, 2017, to collaborate with the European Union on 5G and related technologies.

Related links and articles:

www.brazilgovnews.br

Taiwan News article

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