Solver-as-a-service vendor raises $3 million

March 13, 2018 // By Peter Clarke
OnScale Inc. (Cupertino, Calif.) has raised seed funding of $3 million to launch its solver-as-a-service company for complex engineering calculations that require high-performance computing.

OnScale combines computer aided engineering with high-performance computing to offer online solutions for things like finite element analysis and computational fluid dynamics for applications in 5G, Internet of Things (IoT), biomedical and autonomous driving.

OnScale was co-founded by CEO Ian Campbell, vice president of product development Robbie Banks, and vice president of engineering Gerry Harvey. Campbell co-founded force sensor MEMS company NextInput Inc. (Mountain View, Calif.) and served there as CEO.

Science and engineering consultancy Thornton Tomasetti led the seed round with participation from Silicon Valley investors and Campbell-Klein, an early stage high-tech venture fund.

"The CAE/HPC space is ripe for disruption because yesterday's systems are too expensive and cumbersome to solve tomorrow's engineering problems," said Ian Campbell, CEO, OnScale, in statement.

OnScale will initially focus on helping to design RF filters and RF filters for 5G smartphones and basestations; microphone arrays, motion and gesture sensors,biometric and fingerprint sensors and industrial sensors. In the automotive sector OnScale expects to contribute to the design of 3D ultrasound systems for in-cabin object classification and driver and passenger monitoring.

OnScale has partnered with Amazon Web Services (AWS) and plans to bring the Solver-as-a-Service will be commercially available in Q2 2018.

Related links and articles:

www.onscale.com

News articles:

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Analog, MEMS and sensor startups to follow in 2018


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