Soitec to hire 300 people in 2018

April 05, 2018 // By Peter Clarke
Soitec SA (Bernin, France), developer of the "smart cut" method of silicon-on-insulator (SOI) wafer production, has announced a plan to hire 200 additional staff in 2018 at its main facility near Grenoble. At the same time Soitec plans to add 100 people outside France, at its Singapore and other sites.

Soitec embarked on a major change in its strategy in January 2015 and it has now fully refocused on its original business of microelectronics. The company was able to climb back into profit in 2017 and the recruitment drive is intended to maintain and build that momentum, the company said.

The job positions being opened up cover the full spectrum of work within the company. Multiple internships and work-study programs also will be offered – all paid – together with voluntary assignments to Soitec's Singapore subsidiary.

"The primary goal of the recruitment plan is to enrich our teams by bringing in new staff with complementary expertise gained in different environments, as well as increasing our workforce’s diversity in terms of its skills, culture and personalities," said Pascal Lobry, executive vice president of human resources, at Soitec. "The fresh perspective brought by our new employees will be extremely valuable," he added.

Related links and articles:

www.soitec.com

News articles:

Rising SOI tide lifts Soitec into profit

SOI wafers optimized for NIR, 3D imaging

Soitec launches FDSOI pilot line in Singapore


Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.