1.12 micrometre pixel CMOS image sensor with back-side illumination

1.12 micrometre pixel CMOS image sensor with back-side illumination

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Toshiba Electronics Europe has launched a 1.12 micrometre pixel CMOS image sensor, combining the industry's smallest level pixel size with the enhanced sensitivity and improved imaging performance of back-side illumination technology (BSI). BSI sensors deploy lenses on the rear of the sensor - on the silicon substrate – rather than the front, where wiring limits light absorption.
By eeNews Europe

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This positioning boosts light sensitivity and absorption, and allows the formation of finer quality image pixels in smaller CMOS image sensors. This also makes BSI CMOS sensors more suitable for motion picture applications. Toshiba has made full use of the advantages of BSI to design image pixels with a pitch of 1.12 micrometres, and to pack 8.08 million of them into a 1/4-inch (6.35 mm) sensor.

The company expects BSI CMOS image sensors to become the mainstream technology in portable digital designs, with applications expanding from mobile phones and digital cameras to smartphones and tablets.

Visit Toshiba Electronics Europe at www.toshiba-components.com

 

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