250°C silicon capacitor lines take 11V to 450V

250°C silicon capacitor lines take 11V to 450V

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3D silicon passive components provider IPDiA has launched the ETSC (200°C) and EXSC (250°C) silicon capacitor ranges to expand its product offering to higher voltage MCM applications.
By eeNews Europe


In modern high temperature electronics, where equipment is becoming extremely expensive and where cost of operation is a key driver, everyone is looking for a "must not fail" capacitor, offering high reliability (no early failures, low FIT) and a long operating lifetime, even at 250°C.
To cope with the increasing lifetime requirements, MLCC technologies involve very high de-ratings, leaving no room for miniaturization. Furthermore, these large devices generate extra failures due to ceramic cracks during assembly (unpredictable early failures).

Compared with MLCC, IPDiA MOS technology offers a fully modelled reliability model, which makes the reliability predictable during the lifetime of the application. For example, when best in class MLCC offers max 1000 hours at 250°C, IPDiA Xtreme capacitor range can offer up to 84 000 hours under the same conditions.

Furthermore, electrical tests at end of production avoid all early failures, hence offering a unique reliability capacitor throughout the lifetime of the application at high temperature. The IPDiA Xtreme temperature 3D structure offers a unique density of 250 nF/mm². IPDiA 250°C SiCaps can achieve 100 nF in a 0402 package, when 10×10 nF capacitors in 0603 mounted in parallel are required with a Type I dielectric such as NPO.

The IPDiA SiCap range offers a broad range of values, from 10 pF up to 4.7 µF, with breakdown voltages from 11 V to 450 V, exceeding the overall electrical performance of NPOs or X7Rs thanks to capacitance stability over temperature (60 ppm/°C), voltage and time.

Last but not least, the High Temperature Silicon Capacitor range has been specifically designed to be mounted in high temperature MCMs, with Aluminum pads to be fully compliant with wedge aluminum bonding. This type of assembly process offers space saving on the MCM and solves all assembly issues encountered previously when using hybrid processes

Visit IPDiA at www.ipdia.com

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