Additive photolithographic process yields micro flex circuits with 5µm feature resolution

Additive photolithographic process yields micro flex circuits with 5µm feature resolution

Technology News |
Using additive photolithographic processes, Metrigraphics is able to manufacture Extreme Resolution Micro Flex (ERMF) ultra-miniature passive circuits and structures with traces and spaces as small as 5µm.
By eeNews Europe

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The circuits can also be delivered in complex, high-resolution shapes and patterns for medical sensor applications, including various in body and fluid sensors. The micro circuits are produced with very thin layers of sputtered metal or thicker plated metal such as gold or copper. The company reports that its processes can achieve traces as narrow as 3µm for some designs.

Metrigraphics offers both single and multilayer ERMF circuits. Multilayer circuits include additional conductive layers that are independently stacked, aligned and interconnected. Plated conductive vias connect the different layers as required. Via sizes can be down to 25µm diameter.

Visit Metrigraphics at www.metrigraphicsllc.com

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