HSPA-BGA module now available at Rutronik

HSPA-BGA module now available at Rutronik

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BGA technology is easy to process and permits a high number of inputs and outputs on a relatively small footprint. BGA modules are fitted by means of a grid of solder balls on the underside of the package. The material costs of the product are reduced as no board-to-board connectors…
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BGA technology is easy to process and permits a high number of inputs and outputs on a relatively small footprint. BGA modules are fitted by means of a grid of solder balls on the underside of the package. The material costs of the product are reduced as no board-to-board connectors are required.

The HE863 measures a compact 31.4-mm x 41.4-mm x 2.9-mm. The solder balls are spaced further apart than with most other BGA systems (2-/2.5-mm compared with 0.8-/0.5-mm), making for easier assembly. All models in the series have the same footprint for maximum compatibility.

The HE863 supports quad-band GSM, GPRS/EDGE multislot class 33, 3GPP stack Release 6 and dual-band HSPA with 5.76 Mbps (uplink) and 7.2 Mbps (downlink). There are three pin-compatible variations of HSPA (900/2100, 850/1900 and 850/2100) to enable global use. Telit supplies the module with an optional embedded GPS/A-GPS receiver.

The module is intended for data transmission devices with a long lifetime that are intended for long-term use even after 2G network switch-off and require high throughput. Examples for application fields are smart metering, healthcare, surveillance and tracking applications.

All models in the HE series, which will be launched in stages between now and mid-2011, have very low power consumption. The modules can be used in a temperature range of -40°C to +85°C.

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