Sensor signal-conditioning IC optimized for die stacking
The ZSSC3027 chip is intended for application in calibrated resistive sensor modules in high-resolution industrial, consumer and medical application, the company said. The 16-bit precision analog-to-digital conversion includes features for battery-driven devices, including 930-microampere typical overall current consumption and a 20-nanoamp typical current in sleep mode. The voltage range is 1.7 to 3.6 volts.
The ZSSC3027 can be used to provide digital compensation of signal offset, sensitivity, temperature and non-linearity, via an internal correction algorithm with coefficients stored on-chip in a multiple-time programmable non-volatile memory. Programming is via the ZSSC3027’s serial interface using PC-controlled calibration software provided in the chip’s evaluation kit.
"The ZSSC3027 is designed for stacked die assembly together with a dedicated MEMS sensor element to provide the lowest form factor for MEMS-based sensors on the market. A typical application is barometric pressure sensors for mobile devices," said Michael Georgi, Product Marketing Manager at ZMDI.
The chip offers an accuracy of ±0.10 percent of full-scale output and operates over a temperature range of -40°C to 85°C. It is available as a die for wafer bonding. Die, samples and wafers are available from ZMDI. In component form and in 10,000 piece quantities the ZSSC3027 is priced at €0.70 per unit or US$0.95 per unit.
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