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Siemens takes over UK chip-level analytics expert UltraSoc

Business news |
By Christoph Hammerschmidt

Siemens plans to integrate UltraSoC’s technology into its Xcelerator portfolio as part of Mentor’s Tessent software product suite. The addition of UltraSoC to Siemens enables a unified data-driven infrastructure that can enhance product quality, safety and cybersecurity, and the creation of a comprehensive solution to help semiconductor industry customers overcome key pain points including manufacturing defects, software and hardware bugs, device early-failure and wear-out, functional safety, and malicious attacks. In the context of the takeover, the UltraSoc release highlights data driven product lifecycle management as a central field of application for its technology.

“Siemens’ acquisition of UltraSoC means that our customers can access not just design-for-test, but a comprehensive ‘Design for Lifecycle Management’ solution for system-on-chips, including functional safety, security and optimization,” says Brady Benware, Tessent Vice President and General Manager, Siemens Digital Industries Software. “By utilizing design augmentation to detect, mitigate and eliminate risks throughout the SoC lifecycle, customers can radically improve time-to-revenue, product quality & safety, and profitability. UltraSoC has a fast-growing business and impressive customer list and, as part of Siemens, can complement Tessent to create a truly unique offering in the market.”

UltraSoC is a pioneer of embedding monitoring hardware into complex SoCs to enable “fab-to-field” analytics capabilities designed to accelerate silicon bring-up, optimize product performance, and confirm that devices are operating “as designed” for functional safety and cybersecurity purposes. Tessent is a market leader in SoC design-for-test (DFT) solutions, and has established strengths in the field of automotive functional safety via its Tessent Safety Ecosystem. These two highly complementary offerings are the foundation of a complete package of solutions, encompassing semiconductor design and production, functional safety, cybersecurity, and functional optimization of products in the field.

The combination of Siemens and UltraSoC technology can benefit the entire semiconductor product lifecycle, including structural, electrical, and functional capabilities of SoCs. It also supports Siemens’ comprehensive digital twin with UltraSoC providing monitoring of the real device.


“This acquisition accelerates UltraSoC’s vision at a much larger scale with the assets, industry know-how and footprint of Siemens,” said Rupert Baines, CEO, UltraSoC, adding that being part of a global giant like Siemens will enable UltraSoC to accelerate R&D, leverage a much larger pool of go-to-market resources, and an broad global infrastructure.

UltraSoC‘s products are used in the automotive, high-performance computing, storage and semiconductor industries. The company was recently selected as a participant in the DARPA AISS (Automatic Implementation of Secure Silicon) program; and is a member of the Secure-CAV consortium, an ambitious collaborative project that aims to improve the safety and security of tomorrow’s connected and autonomous vehicles (CAVs). Siemens’ acquisition of UltraSoC is due to close in the fourth quarter of Siemens’ fiscal year 2020. Terms of the transaction were not disclosed.

More information:

UltraSoC teams to monitor chips ‘from fab to field’

Artificial intelligence speeds analog/mixed-signal design

Moortec recasts in-chip thermal sensor for TSMC N5 process

3D-IC Testing with the Mentor Graphics Tessent Platform

Siemens opens its arms to automotive electronics developers

 


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