Sony tips billion-dollar capex for stacked image sensors

Sony tips billion-dollar capex for stacked image sensors

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Sony Corp. has announced an additional $375 million of spending planned for the 2015 fiscal year to further increase its ability to manufacture stacked CMOS image sensors.
By eeNews Europe

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The move is being made in expectation of rapidly growing demand for stacked image sensors for use in smartphones and elsewhere and will take Sony’s image sensor capex for fiscal year 2015 to approximately $1.25 billion.

Sony, the world’s leading supplier of CMOS image sensors, announced plans to spend an additional 45 billion yen (about $375 million) in fiscal year 2015, which ends March 31, 2016, saying the spending would be split with 24 billion yen going to Sony’s Nagasaki facility and 21 billion yen going to its center at Yamagata.

This is in addition to 105 billion yen (about $875 million) that Sony said in February it would in the 2015 financial year to increase its production capacity for stacked CMOS image sensors.

The investment announced in February was expected to bolster production capacity for stacked CMOS image sensors capacity from the current level of 60,000 wafers per month up to 80,000 wafers per month by the end of June 2016. The additional capital expenditure is expected to take production capacity on to 87,000 wafers per month by the end of September 2016.

Stacked CMOS image sensors layer a backside-illuminated pixel die on a separate integrated circuit that performs the signal processing. This arrangement is said to deliver superior image quality and advanced functionality in a compact die. Demand for stacked CMOS image sensors is expected to increase, particularly for use in smartphones and tablet computers.

Related links and articles:

www.sony.co.jp

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