TI tips site for next 300mm analog wafer fab
However, the company said the exact timing for the construction of the analog chip factory, the tool installation and the creation of several hundred jobs associated with the fab, had not yet been decided.
TI already has a 300mm wafer fab there that opened in 2009 with a commitment to analog IC production when such circuits were typically produced on 200mm-diameter wafers.
“Our first Richardson fab, RFAB, was the world’s first 300mm analog fab when it opened in 2009, and has been instrumental in enabling us to support our customers through an exciting period of industry growth, particularly in markets such as automotive and industrial,” said Kyle Flessner, senior vice president of the technology and manufacturing group, at TI in an article on the company’s website.
Flessner said TI would begin construction of a parking garage on the Richardson campus to support an expanded workforce soon but that the construction of the wafer fab would be some in the “next few years.”
“When completed, this state-of-the-art 300mm analog wafer fab will provide the additional capacity we require to manufacture the innovative products our customers need for decades to come,” Flessner concluded.
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