Trillion Sensor Summit preps roadmap
The initial document, in the form of book detailing a minimum set of manufacturing platforms, is expected to appear within one year.
This document will be an effort to "bridge the chasm" from current technical developments to the extremely high volume production envisioned by the organizers of the Trillion Sensor Summit. The roadmap could serve a similar function to the International Technology Roadmap for Semiconductors (ITRS).
Janusz Bryzek, vice president of MEMS and sensor solutions at Fairchild and chair of the Trillion Sensors Summit.
"To accelerate developments, we need to minimize the number of platforms to be developed to perhaps 10 sensor platforms," said Janusz Bryzek, vice president of MEMS and sensor solutions at Fairchild Semiconductor, who called into being and chaired the Trillion Sensors Summit.
Such platforms would likely include MEMS capacitive sensing but also less familiar platforms that are in their infancy such as a generic 3D printed disposable Lab-on-Chip manufacturing process with embedded organic lasers, according to documentation produced at the conference.
Speaking of the Trillion Sensor Summit in an interview with eeNews Europe chair Janusz Bryzek, said: "I invited visionary speakers to attend. The next step is for us to create working groups to identify technology platforms that support multiple applications and to work out what needs to be done to ease the path to volume commercialization. We will then publish that as a book to stimulate development and funding."
Each working group will have a chairperson and several contributors responsible for contributing their chapter for the book. Bryzek said he hopes to see the first revision of the TSensors Roadmap before the next US TSensors Summit in October 2014.
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