Silicon Wafer Integrated Fan-out Technology (SWIFT) Packaging for Highly Integrated Products

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This white paper discusses Amkor's proposal for advanced packaging that goes beyond the scalability limits of traditional organic/inorganic substrates without incurring material and infrastructure costs of silicon interposers. Amkor's proposal to fill the gap between 5 micron and 2 micron line and space minimum dimensions is a chip last high density fan out, incorporates the fine feature size capabilities of wafer-level packaging (WLP) coupled with the advanced flip chip packaging technologies, such as chip on wafer (CoW) and Package-on-Package (PoP). Read More

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