XMC ships stacked BSI image sensors

XMC ships stacked BSI image sensors

Business news |
Wuhan Xinxin Semiconductor Manufacturing Corp. (XMC), a 300mm wafer foundry known for the production of flash memory, has announced its has shipped over 100 million backside illumination (BSI) CMOS image sensors.
By eeNews Europe

Share:

All of those shipped are high end products with resolutions ranging from 5-megapixels to 23-megapixels manufactured using wafer bonding technology. In addition XMC has entered into volume production using 3D wafer stacking technology.

The R&D of wafer-level BSI technology started in the second half of 2012 with an an unnamed partner company and reached mass production at the beginning of 2014. At the beginning of 2015 XMC started mass production of 3D wafer stacking, based on the BSI technology. It is a wafer stacking technology that not only bonds two functional wafers of different process technologies, but also establishes the electrical connection between the two different chips in the bonded wafers.

"We will further enhance our 3D IC expertise on the basis of 3D wafer stacking technology, by which we can achieve high performance and low power through directly connecting the core parts of two chips. 3D IC is expected to be an important technology to keep us on track with Moore’s Law. It is also the key strength for XMC to establish its leadership in 3D IC industry," said Shaoning Mei, CTO at XMC, in a statement.

Related links and articles:

www.xmcwh.com

News articles:

Image sensor startup teams with SMIC

Sony investing in stacked image sensor manufacturing capacity

OmniVision goes stacked for image sensing

CMOS image sensor market on 10.6% CAGR

Linked Articles
eeNews Analog
10s