AI startup raises funds to improve chip yields

September 20, 2021 // By Peter Clarke
AI startup raises funds to improve chip yields
Motivo Inc. (Palo Alto, Calif.), a developer of AI-enabled chip design and analytic software, has raised $12 million in a Series A round of financing.

The round was led by Intel Capital and included Storm Ventures, Seraph Group and Inventus Capital. The financing follow seed rounds of $8 million bringing total capital raised to $20 million.

Motivo said it would use the money to scale its business offering of AI-based products to reduce the time and cost to ramp chips by a factor of 10.

Motivo, founded in 2015, uses AI techniques for feature-extraction that can be applied across the design flow from RTL code to layout geometries and applied to improve yield.

The solution integrates available data from design and yield diagnostics and uses machine learning to identify issues rapidly. Motivo aims to compress the design-to-manufacturing process from years to months.

"The Motivo team has combined decades of expertise in IC design, computational imaging and manufacturing technologies, and artificial intelligence to create solutions that reduce design time to market and accelerate yield ramps for new chips," said Bharath Rangarajan, CEO of Motivo, in a statement.

Related links and articles:

News articles:

Machine learning boost for complex chip and package reliability analysis

EDA flow cuts ASIC modelling time from months to days

Italian EDA startup offers IC, package co-design tool

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.