The offerings will include artificial intelligence and 3D sensing for AIoT devices.
Ambarella is an AI vision silicon company, Lumentum is a designer and manufacturer of optical products, and On Semiconductor is a provider of CMOS image sensor solutions.
The three companies have announced two joint reference designs for AIoT device deployment across verticals, building on the companies’ previous joint solution for contactless access systems.
Lumentum VCSEL array illuminators are combined with an On Semi image sensor and Ambarella's AI processor to achieve accurate biometric access control, 3D electronic locks and other intelligent sensing applications.
"Ambarella's vision is to combine AI processing with 3D and vision sensing to create an ambient intelligent future," said Fermi Wang, CEO of Ambarella, in a statement. The collaboration will advance the convergence of AI and IoT by allowing sensor fusion with AI vision processing, he added
“Image sensors are the eyes for intelligent sensing devices. Their ability to see farther with more detail provides significantly more information for the AI processor’s decision-making in AIoT devices,” said Gianluca Colli, Vice President and General Manager, Industrial and Consumer Sensor Division (ICSD) group at ON Semiconductor.
“Our industry leading RGB-IR sensor technology, combined with the advanced ISP capabilities of Ambarella’s AI vision SoCs, can bring both visible and IR images into devices simultaneously," said Gianluca Colli, general manager of the Industrial and Consumer Sensor Division (ICSD) group at On Semi.
The Vision+ reference design is a 4K (8 megapixel) resolution single-chip solution for depth sensing, AI and video processing, based on the Ambrella CV22 CVflow processor. It has a range of 2 meters due to the Lumentum's VCSEL technology.
The Saturn reference design is aimed at electronic door locks for both commercial and residential applications. It is based on the Ambarella CV25 CVflow AI vision processor and the AR0237CS 2MP RGB-IR image sensor from On Semiconductor.
These joint reference designs and development kits are expected to be available in June.
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