Bosch lays foundation for Dresden chip factory

June 26, 2018 // By Christoph Hammerschmidt
Bosch lays foundation for Dresden chip factory
The Bosch Group has laid the foundation stone for its new semiconductor fab in Dresden (Germany). The fab in Dresden is Bosch’s second semiconductor manufacturing site; the first one is located in Reutlingen near Stuttgart. Bosch is setting a stringent pace in the construction of the factory; the production machines are to be installed already by the end of 2019.

In the new fab, Bosch will primarily manufacture integrated circuits for automotive applications and for use in the Internet of Things (IoT) - for the first time for the company on 300 mm wafers. Pilot production in the 72,000 square meter building is scheduled to begin at the end of 2021. For the time being, 700 employees are planned to operate the highly automated production plant. The production should run according to the most modern technologies (Industry 4.0) and network itself automatically by means of AI.

The investment sum for the new production plant amounts to around 1 billion euros, the largest single investment ever for the Swabian automotive and industrial supplier.

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