In a race to introduce heterogeneous integration – otherwise known as chiplet packaging – firms such as ASE, TSMC, Intel, Amkor and JCET have announced large capex investments in 2021.
TSMC is planning to spend between US$2.5 billion and US$2.8 billion in 2021 to gear up its own packaging factories with its InFO, CoWoS, and SoIC-based product lines. Yole estimates that TSMC generated US$3.6 billion revenue from advanced packaging in 2020 (see TSMC preps for 'chiplet' style manufacturing in 2021 ).
Advanced packaging capital expenditure planned for 2021. Source: Yole Developpement.
OSAT market leader ASE also announced a US$2.0 billion capex for its booming system-in-package and wafer-level packaging businesses.
Intel has announced it will invest US$20 billion building wafer fabs in Arizona (see Intel to build two wafer fabs, be foundry for Europe ) and that it will also invest in advanced packaging collaborations as its expands its Foveros/EMIB packaging manufacturing at factories in Arizona and Oregon.
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