Chiplets refer to the separate die that make up a large multi-die chip component. There is increasing interest to move towards this form of heterogeneous integration because not all functions benefit from, or justify, the extreme cost of scaling to the leading edge.
Transparency Market Research forecasts that the market with enjoy a compound annual growth rate (CAGR) of 40.9 percent over the period to 2031. Such a growth rate would see the market worth about $1.5 billion in 2021, about $2 billion in 2022 and $3 billion in 2023.
In terms of market share the firm reckons Asia-Pacific represents nearly 50 percent of the market in 2021, North America about one-third and Europe about one-sixth of the market.
In terms of applications consumer electronics is the largest part of the market followed by automotive electronics, the firm states.
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