Chiplet platform company names ASE as partner

August 24, 2017 // By Peter Clarke
Chiplet platform company names ASE as partner
zGlue Inc. (Mountain View, Calif.), which is offering a 2.5D interposer-based platform for the design of systems in package, has named Advanced Semiconductor Engineering Inc. (ASE) as its strategic manufacturing partner.

zGlue was founded in 2014 by two former executives with Samsung Electronics: Ming Zhang, who serves as CEO and Jawad Nasrullah, who serves as CTO.

The method being developed by zGlue uses a silicon interposer to let developers integrate multiple die into single compact component and it also covers software building blocks. The company is claiming this method based on silicon-proven chiplets and programmable fabric allows compact designs that are suitable for wearables and Internet of Things applications. zGlue is claiming it can provide access to industry-standard IoT building blocks for design and manufacturing with the benefits of system flexibility and fast time to market.

The platform is called ZiP for zGlue Integrated Platform and ASE provides multiple options for assembling zGlue-certified chiplets interconnected through the zGlue silicon interposer platform.

"ASE is committed to supporting innovative technologies and companies that add value to the semiconductor and advanced packaging industries," said Mike Hung , senior vice president with ASE, in a statement issued by zGlue. "We are pleased to support them as their packaging, assembly and test partner as they bring their technology and products to the mass market."

Related links and articles:

www.zglue.com.

www.aseglobal.com.

News articles:

zGlue fabric reduces size of wearable tech

Imec, SPTS developing key tool for 3D chips

BASF to form 3D printing subsidiary


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