Suitable applications could include smart lighting, home security and monitoring, temperature control, fire and gas detectors, and fitness wearables.
The T100 is based on a 28nm manufacturing process, although Samsung did not state which of the three variants it makes – bulk CMOS, FinFET or FDSOI.
The T100 back fills a range that includes the Exynos i T200 for Wi-Fi applications and Exynos i S111 for long-range narrowband-IoT. The T200 has twin processor cores on-chip; the Cortex-R4 operating at 320MHz clock frequency and the Cortex-M0+ operating at 320MHz. The S111 has a single Cortex-M7 operating at 200MHz.
Samsung has not revealed what processor core is inside the T100, but it is likely to single low-power core to minimize power consumption and maximize battery life, such as Cortex-M3 or Cortex-M0.
The Exynos i T100 supports Bluetooth Low Energy (BLE) 5.0 and Zigbee 3.0, and also integrates the processor with memory in a small single-chip package.The chip comes with a separate security subsystem (SSS) hardware block for data encryption and a physical unclonable function (PUF) that creates a unique identity for each chipset.
The chip is specified for a broad temperature range -40°C and up to 125°C and is currently sampling.
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