Glass substrate startup gets seed funding

March 05, 2020 //By Peter Clarke
Glass substrate startup gets seed funding
Microelectronics and photonics packaging company Mosaic Microsystems Inc. (Rochester, New York) has raised $2 million in seed funding.

The company is focused on providing thin glass substrates and through-glass via (TGV) interconnect for RF communications, particularly for 5G, as well as MEMS and sensors for the internet of things (IoT).

BlueSky Capital led the investment round with participation from Corning Inc. and Jeremy Wooldridge, general manager of Samtec Microelectronics is joining Mosaic’s board of directors under the terms of the deal.

The funding builds on a year for Mosaic in which it secured an exclusive license from Corning for thin glass handling solutions and a Phase I NASA SBIR contract to establish manufacturable implementation of thin glass for next generation electronics packaging.

"We believe the market will continue to require new and differentiated thin substrate solutions for RF communications and advanced packaging," said Madison Hamman, managing director of BlueSky Capital, in a statement. "Mosaic is well positioned to establish these solutions for the industry and we are excited to collaborate with and support them as they work to build a great company in an exciting industry."

At the heart of Mosaic’s solution is a proprietary temporary bond technology. This allows for precision via fill with conductive materials using established semiconductor processes and equipment.

Related links and articles:

www.mosaicmicro.com

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