Global 200mm wafer processing on 3.9% CAGR

February 13, 2019 //By Peter Clarke
Global 200mm wafer processing on 3.9% CAGR
Strong demand for MEMS and sensors, automotive and industrial circuits will drive an increase of chip production on 200mm-diameter wafers over the next three years, according to industry body SEMI.

SEMI predicts that global wafer production capacity on 200mm wafers will go from about 5.8 million wafer starts per month in 2019 to 6.5 million wafer starts per month in 2022. This increase of 700,000 wpm in capacity represents a 12 percent increase – although SEMI reports it as 14 percent increase. A 12 percent increase equates to a compound annual growth rate of 3.9 percent.

Over the same period SEMI expects shipments of wafers dedicated to MEMS and sensor devices to increase by 25 percent. Similarly shipments of 200mm-diameter wafers for power devices and through foundries are forecast to jump by 23 and 18 percent, respectively.

The SEMI has added seven new facilities, with 160 updates to 109 fabs, since the previous publication of its Global 200mm fab outlook in July 2018. In the next three years 16 new facilities, 14 of them volume wafer fabs, are expected to begin operation.

Related links and articles:

www.semi.org

News articles:

TSMC to build 200mm fab for IoT, analog, sensors

CEO interview: Sonderman on SkyWater's technology foundry model

SMIC preps the world's largest 200mm wafer fab

Hanking offers MEMS foundry services


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