At the end of 2020 sub-10nm wafer capacity is expected to account for 10 percent of a total wafer capacity of 21.09 million 200mm equivalents per month.
However, the cost benefits of scaling are reducing and below 10nm they are prohibitive for most customers and most suppliers. Only Intel, Samsung and TSMC operate fabs using sub-10nm process technology.
Monthly installed wafer manufacturing capacity by minimum geometry for December 2019 to December 2024. Source: IC Insights.
South Korea has more than 66 percent of its capacity dedicated to sub-20nm process technology partly because of presence of SK Hynix and Samsung in memory component manufacturing.
While there is sub-20nm manufacturing capacity in China most of its owned by foreign companies, Samsung, SK Hynix, Intel and TSMC. SMIC and YMTC are the only China-headquartered manufacturers offering sub-20nm process technology.
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