Hyperdimensional computing helps improved AI fit on PCM chip: Page 2 of 2

June 03, 2020 //By Peter Clarke
Hyperdimensional computing helps improved AI fit on PCM chip
Researchers from IBM Zurich and ETH Zurich (Swiss Federal Institute of Technology in Zurich) have benchmarked a hyperdimensional computing (HDC) system based on analog in-memory computing within phase-change memory arrays.

The approach was tested by IBM on a prototype PCM chip in a 90nm process that includes 760,000 phase-change memory elements in a cross-bar arrays. It was applied to three tasks: language classification; news classification; and gesture recognition. The results were compared with the design of system-level hyperdimensional computing processor targeting 65nm CMOS, and showed a 6x advantage in energy efficiency and a 3.74× reduction in die area for in-memory computation.

The authors point out that further improvement are likely through improvements to the peripheral circuitry.

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