Infineon 3D image sensor used by Qualcomm

March 05, 2020 //By Peter Clarke
Infineon 3D image sensor used by Qualcomm
Infineon Technologies AG has worked with Qualcomm Technologies Inc. to develop a reference design for 3D authentication in mobile phones.

The reference design is based on the Snapdragon 865 mobile phone processor and uses the REAL3 3D Time-of-Flight (ToF) sensor. It demonstrates that a mobile phone based on this platform can be used for face authentication, enhanced photo features and authentic augmented reality experiences.

The 3D image sensor captures 940 nm infrared light reflected from the user and the scanned objects and high-level data processing to achieve accurate depth measurements. Infineon develops the 3D ToF sensor technology in cooperation with the software and 3D time-of-flight system specialist pmdtechnologies AG.

Infineon offered the Real3 for face recognition two years ago (see Infineon, PMD offer 3D image sensor for face recognition ). At that time the Real3 (or IRS238xC) enabled a camera module for integration in smartphones with a footprint of less than 12mm by 8mm, including the receiving optics and VCSEL illumination. Infineon now offers a VGA resolution sensor with a die area of 4.4 mm by 5.1 mm.

Starting in March 2020, Infineon's REAL3 ToF sensor will enable the video bokeh function in a 5G-capable smartphone for image effects even in moving images.

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