Infineon offers to build 300mm wafer fab in Dresden: Page 2 of 2

March 08, 2021 // By Peter Clarke
Infineon offers to build 300mm wafer fab in Dresden
German chip company Infineon Technologies AG is planning to spend between €1.1 billion and €2.4 billion expanding chip production in Dresden, according to an interview with site managers.

Morgenstein is reported saying that Infineon's existing Dresden wafer fab is running at maximum capacity due to demands brought by a mix of the automotive sector, 5G communications and the Covid-19 pandemic. This why Infineon is considering spending €1.1 billion to expand the existing fab.

The additional wafer fab, if construction is agreed, would be focused on high-voltage power semiconductors such as those used in electric car motors and wind turbines, the report said. Infineon Dresden has submitted both proposals as part of the IPCEI-2 process, it added.

Infineon already plans to spend €140 million in Dresden in 2021 to expand production capacity from 30,000 wafers per month to 33,000 wpm. An additional wafer fab for power semiconductors is also being brought up in Villach, Austria. There is a plan is to merge the Dresden and Villach factories into one virtual factory for power semiconductors, the report said.

Related links and articles:

Oiger report

www.infineon.com

News articles:

Globalfoundries plans to boost production

Germany ready to help Europe invest 'billions' in chip manufacturing

TSMC has no "concrete" plans to make chips in Europe

Bosch's Dresden wafer fab prepares for production


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