Intel, Samsung, TSMC to drive chip packaging forward: Page 2 of 3

September 08, 2020 //By Peter Clarke
Intel, Samsung, TSMC to drive chip packaging forward
Yole Developpement has provided advanced packaging technology roadmaps, market estimates and a ranking of packaging companies.

However, the advanced packaging market will decrease in 2020 by 7 percent while the traditional packaging market will decrease by 15 percent due to the impact of the Covid-19 pandemic on the semiconductor market.

Top 25 packaging houses (OSATs) by 2019 revenue (in $M). Source: Yole Developpement.

In the longer term Yole reckons the traditional packaging market will grow with a CAGR2019-2025 of 1.9 percent and the total packaging market will grow with a CAGR2019-2025 of 4 percent to reach $43 billion and $85 billion, respectively.

Next: Three players left


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