Intel, Samsung, TSMC to drive chip packaging forward: Page 3 of 3

September 08, 2020 //By Peter Clarke
Intel, Samsung, TSMC to drive chip packaging forward
Yole Developpement has provided advanced packaging technology roadmaps, market estimates and a ranking of packaging companies.

In terms of packaging format, the highest CAGRs will be experienced by 2.5D/3D, embedded die, and fan-out with 21, 18 and 16 percent respectively.

Technology roadmap for advanced packaging 2015 to 2025. Source: Yole Developpement.

Ruurd Boomsma, CTO of packaging equipment supplier BESI, commented: "A new era of advanced packaging is at our doorstep. From advanced flip-chip and fan out technologies, now new and more advanced technologies are needed for assembly of double-sided SiP, as well new TCB and hybrid bonding solutions for complex heterogenous packaging are required. This in combination with different carriers for Known Good dies – trays, TnR, reconstructed wafer – and other interposers – wafer, panel, substrate – opens opportunities for new, innovative and cost effective, equipment that offer very high accuracy, high yield and high speed."

Related links and articles:

www.yole.fr

News articles:

TSMC leads the fan-out packaging boom

Chiplet-savvy TSMC to build $10 billion assembly and test plant

ASE dominates top 25 ranking of chip packagers

TSMC preps for 'chiplet' style manufacturing in 2021

Birth of chiplet market shows more than 40% annual growth


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