In terms of packaging format, the highest CAGRs will be experienced by 2.5D/3D, embedded die, and fan-out with 21, 18 and 16 percent respectively.
Technology roadmap for advanced packaging 2015 to 2025. Source: Yole Developpement.
Ruurd Boomsma, CTO of packaging equipment supplier BESI, commented: "A new era of advanced packaging is at our doorstep. From advanced flip-chip and fan out technologies, now new and more advanced technologies are needed for assembly of double-sided SiP, as well new TCB and hybrid bonding solutions for complex heterogenous packaging are required. This in combination with different carriers for Known Good dies – trays, TnR, reconstructed wafer – and other interposers – wafer, panel, substrate – opens opportunities for new, innovative and cost effective, equipment that offer very high accuracy, high yield and high speed."
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