Kioxia, Western Digital develop 162-layer 3D-NAND: Page 2 of 2

February 22, 2021 // By Peter Clarke
Kioxia, Western Digital develop 162-layer 3D-NAND
Kioxia Corp., formerly Toshiba Memory, and partner Western Digital, have announced a 162-layer 3D NAND flash memory technology.

aspects of their sixth generation of 3D-NAND in Session 30 of the International Solid-State Circuits Conference (ISSCC) along with papers from SK Hynix (176 layers), Intel (144 layers) and Samsung (160+).

Related links and articles:

www.kioxia.com

www.westerndigital.com

News articles:

3nm GAA process, compute-in-memory among highlights of ISSCC 2021

SK Hynix joins Micron on 176 layers for 3D-NAND flash

Kioxia announces another 3D-NAND wafer fab


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