Kioxia Corp., formerly Toshiba Memory, and partner Western Digital, have announced a 162-layer 3D NAND flash memory technology.
aspects of their sixth generation of 3D-NAND in Session 30 of the International Solid-State Circuits Conference (ISSCC) along with papers from SK Hynix (176 layers), Intel (144 layers) and Samsung (160+).
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3nm GAA process, compute-in-memory among highlights of ISSCC 2021
