This is a couple of years later than company CEO Miin Wu told eeNews Europe would be the case back in 2016 (see Macronix preps 3D-NAND market entry, says CEO ). At that time Wu said Macronix was working towards a 3D-NAND product introduction in 2018, which the company would make at one of its three wafer fabs in Taiwan.
The latest report said Macronix is working on 48- and 96-layer processes to deliver 128Gbit and 256Gbit products.
In order to meet the production schedule, Macronix is increasing R&D efforts and will upgrade its 300mm wafer fabrication process, the report quoted Lu as saying.
Macronix is moving to a 19nm process for conventional 2D NAND flash chips and manufacturing NOR flash products using mainly 55nm process technology.
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