Micron plans for $7 billion Japanese DRAM fab

October 25, 2021 // By Peter Clarke
Micron plans for $7 billion Japanese DRAM fab
Micron Technology Inc. is planning to spend up to 800 billion yen (about US$7 billion) to build a DRAM wafer fab in Hiroshima prefecture, Japan, according to a Nikkan Kyogo report.

Micron will purchase land near existing facilities in Higashihiroshima city and the Japanese government is expected to provide subsidies.

The DRAM wafer fab is expected to start production in 2024 and create between 2,000 and 3,000 jobs

The move follows an announcement that foundry chipmaker TSMC plans to build a wafer fab in Japan with Sony as the anchor customer. In that case the Japanese government is reportedly ready to provide 500 billion yen or about half of a $9 billion price tag.

Micron has said it plans to spend $150 billion on capex and R&D over the next decade.

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Micron plans to spend $150 billion on memory production

TSMC-Sony Japan wafer fab plans progress

TSMC confirms German, Japanese fab plans

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Intel in talks with Bavaria over wafer fab location

Intel seeks $10 billion subsidy for 'EuroFab'

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