Qualcomm, China's BOE form display-plus-sensor collaboration

April 21, 2020 //By Peter Clarke
Qualcomm, China's BOE form display-plus-sensor collaboration
Qualcomm Technologies Inc. has announced a collaboration with BOE Technology Group Co. Ltd. (Beijing, China) to develop displays incorporating Qualcomm's under-glass ultrasonic 3D fingerprint sensor.

The collaboration is relevant to smartphones but is expected to extend from mobile and associated 5G technologies to XR and IoT.

The companies have been working on including Qualcomm 3D Sonic sensors onto BOE's flexible OLED displays. Based on the collaboration, BOE will offer integrated displays with Qualcomm 3D Sonic fingerprint sensors to its customers. Smartphones featuring this integrated solution are expected to be available in the second half of 2020.

Related links and articles:



News articles:

Startup gets backers for ultrasound interface

Samsung recalls foldable smartphone

Apple, Samsung beaten to launch of foldable smartphone

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.