Report: TSMC, Japan to share cost of Tokyo chip facility: Page 2 of 2

January 05, 2021 // By Peter Clarke
Report: TSMC, Japan to share cost of Tokyo chip facility
Leading foundry TSMC will establish a 50:50 joint venture with Japan's Ministry of Economy, Trade and Industry, to set up an IC packaging and testing facility in Tokyo, according to a Taiwanese report.

However, TSMC is making strategic moves to add heterogeneous multi-die packaging to its foundry service offering. Typically packaging and test of ICs has been conducted by a separate set of service providers, also typically based in Taiwan or elsewhere in southeast Asia. These OSAT companies then ship chips on to equipment makers. A clear marker of TSMC's intentions in packaging was set down In 2020 when TSMC announced plans to spend $10 billion on an IC assembly, packing and test facility in Miaoli, northern Taiwan (see Chiplet-savvy TSMC to build $10 billion assembly and test plant).

The joint-venture with Japan's government would be TSMC's way of sharing its expertise in 'chiplet'  heterogeneous multi-die component manufacturing with Japanese semiconductor companies.

TSMC and Japan are expected to sign a memorandum of cooperation to set up the advanced packaging and testing plant soon.

Related links and articles:

TSMC picks Arizona for 5nm wafer fab

Now Japan wants a domestic TSMC fab

TSMC dragged to the altar of US manufacturing

Chiplet-savvy TSMC to build $10 billion assembly and test plant

Opinion: Money's not the problem for Europe's semiconductor rebuild

Lossmaking Indie Semi to go public in $1.4 billion deal


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