Samsung planning $10 billion 3nm fab in Texas

January 25, 2021 //By Peter Clarke
Samsung planning $10 billion 3nm fab in Texas
Samsung is considering spending more than $10 billion to build a wafer fab capable of 3nm chip production in Austin, Texas, according to a Bloomberg report.

This follows the move by TSMC to build a 5nm wafer fab in Phoenix, Arizona with US government support ( TSMC hiring for Arizona wafer fab ). Samsung is also expected to receive significant US government support for its commitment, which is reported to be under negotiation.

Samsung bought land in 2020 and recently applied for planning permission. The plan calls for construction of the shell to start this year with production of wafers to begin in 2023. That would be on a similar time-line or even slightly ahead of that of TSMC.

In May of 2020 that Intel was reported to be in discussions with the US Department of Defense and that TSMC was in discussions with the US Department of Commerce and that Samsung was also being approached about expanding its presence in Austin (see US talks to Intel, TSMC about building local foundry fabs ).

The moves are part of a coordinated initiative to re-inforce chip manufacturing in the US for strategic reasons.

Related links and articles:

TSMC hiring for Arizona wafer fab

Samsung included in Intel outsourcing talks

US talks to Intel, TSMC about building local foundry fabs

3nm GAA process, compute-in-memory among highlights of ISSCC 2021

Second piece of US legislation earmarks $25 billion for domestic chip making

CHIPS for America Act promises $22.8 billion in aid  


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