Startup Chirp Microsystems to become part of TDK's InvenSense: Page 2 of 2

February 28, 2018 //By Julien Happich
TDK Corporation announced it has reached an agreement with Californian startup Chirp Microsystems, a developer of unique MEMS-based ultrasonic 3D-sensing solutions. Under the agreement, Chirp will become a wholly owned subsidiary of TDK.

"I believe they are traditionally good at keeping their acquired companies as is, leaving them alone, which should allow us to continue to grow, but with guaranteed resources" Kiang added.

In the short term, the fabless company will continue to outsource the manufacturing of its MEMS ToF sensors to external fabs.

"We are looking at how we could leverage their technology and know-how and take advantage of that in our production process, but for now, we're still working with our foundry partners and purchase wafers from them", Kiang told eeNews Europe.

"We have a couple of key manufacturing partners moving to mass production and on the customer side, we have traction in many different segments, with substantial design wins to be announced over the next few months", Kiang said as a way to conclude the interview, adding that the CH-101 and CH-201 MEMS ToF chips announced last year would be shipping in high volume consumer products in the second half of 2018.

“Our vision is to be the leading solutions provider of sensors for motion, sound, environmental elements (pressure, temperature and humidity), and ultrasonic sensors for the Internet of Things (IoT) era,” said in a company statement Noboru Saito, Senior Vice President, TDK and CEO of Sensor Systems Business Company. Saito expects the new acquisition to propel TDK as the leader in ultrasonic MEMS technology.

Related links and articles:

Related articles:

Hardly any competition for Chirp's ultrasonic ToF sensor chips

Chirp launches sonar ToF gesture IC

Vous êtes certain ?

Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.

Vous allez être rediriger vers Google.