TSMC to build 200mm fab for IoT, analog, sensors

December 12, 2018 //By Peter Clarke
TSMC to build 200mm fab for IoT, analog, sensors
The world's leading foundry Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan) is planning to build a wafer fab to run speciality and 'More-than-Moore' processes on 200mm-diameter wafers.

The move would be the first time TSMC has added capacity for 200mm wafers for 15 years and it is being done to meet demand for mature technologies. TSMC offers a range of specialty technologies including power management ICs, CMOS image sensors and MEMS.

The disclosure was made by C.C.Wei, vice chairman and CEO, in a speech at his company's annual supply chain management forum.

The fab, TSMC's fifth for 200mm diameter wafers, is to be built at Tainan, adjacent to Fab 6, also a 200mm wafer fab. The fab is expected to come online in 2020, reports said.

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200mm wafer demand driving growth in Asia

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