The move would be the first time TSMC has added capacity for 200mm wafers for 15 years and it is being done to meet demand for mature technologies. TSMC offers a range of specialty technologies including power management ICs, CMOS image sensors and MEMS.
The disclosure was made by C.C.Wei, vice chairman and CEO, in a speech at his company's annual supply chain management forum.
The fab, TSMC's fifth for 200mm diameter wafers, is to be built at Tainan, adjacent to Fab 6, also a 200mm wafer fab. The fab is expected to come online in 2020, reports said.
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