TSMC to recruit 8,000 for 3nm push

November 05, 2019 //By Peter Clarke
TSMC to recruit 8,000 for 3nm push
Leading semiconductor foundry TSMC is planning to hire 8,000 engineers at a new R&D center in Hsinchu dedicated to 3nm process development, according to local reports.

TSMC chairman Mark Liu disclosure of the plan and that construction of the 3nm research centre is due by the end of 2020 was reported by Taiwan News.

In October TSMC was reported to have started work on construction of wafer fab for 3nm circuit production that was anticipated to cost $19.6 billion and would be completed in 2023.

Analysts reckon TSMC has about 90 percent of the market for 7nm chips and is therefore in a positon to dominate leading-edge production at both the 5nm and 3nm nodes.

TSMC recently ramped its capital expenditure budget for 2019 by $5 billion

Related links and articles:

www.tsmc.com

News articles:

TSMC presses capex accelerator with $5 billion hike

TSMC to present 5nm CMOS, 22nm STT-MRAM at IEDM

Globalfoundries, TSMC resolve patents dispute


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