X-Fab offers chiplet support via X-Celeprint printing process

September 07, 2021 // By Peter Clarke
X-Fab offers chiplet support via X-Celeprint printing process
X-Fab Silicon Foundries is offering high-volume micro-transfer printing (MTP) capabilities following the signing of a license agreement for the technology with X-Celeprint Ltd.

X-Celeprint (Cork, Ireland) is a wholly-owned subsidiary of Xtrion NV (Tessenderlo, Belgium) with facilities within the Tyndall National Institute. Xtrion is a holding company with majority shares in both Melexis and X-Fab Silicon Foundries.

The print transfer process supports heterogeneous integration of different semiconductor process technologies – otherwise known as chiplet component assembly.

The monolithic processes could include SOI, GaN, GaAs and InP, as well as MEMS, X-Fab said.

X-Fab said it has made investments over the last two years to support customers with MTP-based heterogeneous integration to support scalable business and migration to volume production.

X-Celeprint’s MTP technology stacks and fans-out ultra-thin dies based on different process nodes, technologies, and wafer sizes. It results in the formation of 3D stacked ICs, which have enhanced performance, greater power efficiency, and take up less space.

"By licensing X-Celeprint's disruptive MTP technology, we are uniquely positioned in our ability to facilitate the incorporation of numerous different semiconductor technologies. X-Fab customers will be able to utilize a technology that no other foundry is offering, and existing X-Celeprint customers may now tap into capacity levels that will easily meet their future demands," said Volker Herbig, vice president of MEMS business unit at X-Fab.

"Signal conditioning, power, RF, MEMS, and CMOS sensors, optoelectronic devices, optical filters, and countless other possibilities will all be covered," he added.

"Our agreement with X-Fab represents a major milestone in the commercialization of MTP technology, broadening the number of customers and applications," said Kyle Benkendorfer, CEO of X-Celeprint, in the same statement. "High-volume heterogeneous integration of elements derived from various different source wafers will provide the semiconductor industry with significant new capabilities, including access to higher density devices with more functionality, fabricated at high yields and lower cost, within shorter timeframes."

Related links and articles:

www.xfab.com

www.x-celeprint.com

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