X-Fab claims the process offers higher reliability than options offered by the competition.
Galvanic isolation, typically through magnetic isolation is used to remove ground-loops, improve noise immunity and protect human interfaces from connection to high voltages, such as the control of IGBT or SiC power modules in industrial and automotive environments.
The X-Fab process includes operational temperatures up to 175°C with withstanding voltages of up to 6kVrms at 50Hz an 10kVdc. There is support for working voltages up to 1.7kV.
X-Fab offers two packaged galvanic isolation devices for customer evaluation. The capacitive coupler test chip, G3-C1, has an isolation layer thickness of 11 micron and was tested to withstand up to 6kVrms. An inductive coupler test chip, G3-T06, is also available for customer evaluation and has an isolation layer thickness of 14 micron.
The galvanic isolation technology is manufactured at the company's Dresden facility, which is certified for automotive manufacturing.
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