This technical note discusses how a Transition-Mode active clamp flyback (ACF) converter can be used to recover leakage energy and reduce or remove switching losses, compared to a QRF.
All DC/DC power modules generate heat. Until devices with 100% efficiency hit the market, there’s just no way around this reality. One of the best ways to manage this heat is through PCB copper. But how much is needed? Use this step-by-step guide to come up with a quick and easy estimate.
This white paper explores how GaN-based power supply solutions focus on enabling system designers to save space and achieve greater power efficiency while simplifying the design process and supporting creation of energy-efficient systems for a greener world.
Read this white paper where we examine the barriers of achieving higher power density and to learn about technologies that can help you overcome them.
Following the techniques in this article, a converter design’s thermal performance can be estimated before building the first prototype board. This will enable fasterto- market project builds and avoid thermal issues down the road. In designs where thermal performance is an issue, the techniques outlined in this article can be used to further improve thermal performance and finish the PCB
As the field sensor housing gets smaller, the constraint on PCB size becomes more of a challenge for board designers to provide power to the sensors. In this case, the LMR36506 is an option for meeting this challenge.
Read TI's new technical article to learn how we're resolving the complexities of larger screen sizes in automotive applications.
This paper examines the benefits of combining USB Type-C PD and buck-boost charging for portable electronic designs
Si vous désactivez les cookies, vous ne pouvez plus naviguer sur le site.
Vous allez être rediriger vers Google.